专利名称: | ALLOY OF TUNGSTEN (W) AND COPPER (CU) HAVING FUNCTIONALLY GRADED MATERIAL (FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU | |
文摘: | Disclosed are a tungsten-copper alloy, a metal material having the same and a fabrication method for the tungsten-copper alloy, the fabrication method including generating tungsten-copper composite powders such that tungsten is coated on copper powders and the composition ratios of copper and tungsten are different, sequentially laminating the tungsten-copper composite powders to create a plurality of layers, having sequentially increasing or decreasing contents of tungsten, and sintering the plurality of layers under conditions of temperature and time preset for generation of tungsten-copper alloy, whereby the tungsten-copper alloy and high thermal conductivity and fabrication reliability by virtue of precise morphologies can be created. | |
申请日期: | 2011.03.03 | |
公开(公告)日: | 2012.04.19 | |
申请(专利)号: | WO2011KR01471 | |
公开(公告)号: | WO2012050271(A1) | |
主分类号: | C22C27/04,C,C22,C22C,C22C27 | |
分类号: | C22C27/04,C22C1/04,C,C22,C22C,C22C27,C22C1 | |
优先权: | KR20100099194 20101012 | |
申请(专利权)人: | AGENCY FOR DEFENSE DEVELOPMENT,LEE, SEONG,NOH, JOON WOONG | 订阅此字段 |
发明(设计)人: | LEE, SEONG,NOH, JOON WOONG | 订阅此字段 |
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