ALLOY OF TUNGSTEN (W) AND COPPER (CU) HAVING FUNCTIONALLY GRADED MATERIAL (FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU

专利名称：	ALLOY OF TUNGSTEN (W) AND COPPER (CU) HAVING FUNCTIONALLY GRADED MATERIAL (FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU
文摘：	Disclosed are a tungsten-copper alloy, a metal material having the same and a fabrication method for the tungsten-copper alloy, the fabrication method including generating tungsten-copper composite powders such that tungsten is coated on copper powders and the composition ratios of copper and tungsten are different, sequentially laminating the tungsten-copper composite powders to create a plurality of layers, having sequentially increasing or decreasing contents of tungsten, and sintering the plurality of layers under conditions of temperature and time preset for generation of tungsten-copper alloy, whereby the tungsten-copper alloy and high thermal conductivity and fabrication reliability by virtue of precise morphologies can be created.
申请日期：	2011.03.03
公开（公告）日：	2012.04.19
申请（专利）号：	WO2011KR01471
公开（公告）号：	WO2012050271(A1)
主分类号：	C22C27/04,C,C22,C22C,C22C27
分类号：	C22C27/04,C22C1/04,C,C22,C22C,C22C27,C22C1
优先权：	KR20100099194 20101012
申请（专利权）人：	AGENCY FOR DEFENSE DEVELOPMENT,LEE, SEONG,NOH, JOON WOONG	订阅此字段已订阅此字段
发明（设计）人：	LEE, SEONG,NOH, JOON WOONG	订阅此字段已订阅此字段