注册

全部类型

  • 全部类型
  • 发明专利
  • 实用新型
  • 外观设计
高级检索
专利名称: ALLOY OF TUNGSTEN (W) AND COPPER (CU) HAVING FUNCTIONALLY GRADED MATERIAL (FGM) LAYERS, METAL MATERIAL HAVING THE SAME AND MANUFACTURING METHOD FOR ALLOY OF W AND CU
文摘: Disclosed are a tungsten-copper alloy, a metal material having the same and a fabrication method for the tungsten-copper alloy, the fabrication method including generating tungsten-copper composite powders such that tungsten is coated on copper powders and the composition ratios of copper and tungsten are different, sequentially laminating the tungsten-copper composite powders to create a plurality of layers, having sequentially increasing or decreasing contents of tungsten, and sintering the plurality of layers under conditions of temperature and time preset for generation of tungsten-copper alloy, whereby the tungsten-copper alloy and high thermal conductivity and fabrication reliability by virtue of precise morphologies can be created.
申请日期: 2011.03.03
公开(公告)日: 2012.04.19
申请(专利)号: WO2011KR01471
公开(公告)号: WO2012050271(A1)
主分类号: C22C27/04,C,C22,C22C,C22C27
分类号: C22C27/04,C22C1/04,C,C22,C22C,C22C27,C22C1
优先权: KR20100099194 20101012
申请(专利权)人: AGENCY FOR DEFENSE DEVELOPMENT,LEE, SEONG,NOH, JOON WOONG 订阅此字段
发明(设计)人: LEE, SEONG,NOH, JOON WOONG 订阅此字段

说明书全文

导出

添加到对比列表

系统自动标引

即机标。是指由计算机根据文献内容,依据一定的算法自动赋予的关键词

用户手工标引

是指机构购买用户根据其相关行业背景知识,结合对文献内容的理解提炼出的关键词

知识产权声明 | 联系我们 | 人才招聘 | 客户服务 | 关于我们

京ICP证:010071   京公网安备11010802020237号   京ICP备08100800号-1

万方数据知识服务平台--国家科技支撑计划资助项目(编号:2006BAH03B01)©北京万方数据股份有限公司  万方数据电子出版社